Vacuum Assisted Reflow 在線式真空回流爐
Heller Industries has developed a vacuum module that inserts directly in its reflow oven line to meet rising demand of high volume, void free, automated inline soldering. This vacuum assisted reflow has been shown to reduce the voids in a solder joint by 99% and allows thermal profiles to be directly ported from non-vacuum reflow applications to
achieve low COO and high UPH.
Features 主要特點
Heller在線式真空回流爐可實現(xiàn)真空焊接的自動化規(guī)模量產(chǎn)，降低生產(chǎn)成本；
內(nèi)置式真空模組，分五段精準(zhǔn)抽取真空，實現(xiàn)無空洞焊接 (Void < 1％)；
可直接移植普通回流爐的溫度曲線，曲線方便可調(diào)。
? Applies multi-zones to suit various thermal profile requirements
多溫區(qū)設(shè)計，更多溫控點，滿足不同溫度曲線要求
? Able to achieve < 1% total void area spec
有效消除空洞，總空洞面積可控制在1%以下
? Provides optimized cycle (average 30~60s) to achieve high UPH
高效生產(chǎn)能力，平均生產(chǎn)節(jié)拍在30~60秒
? Utilizes advanced pumping package for fast pump down time
高效無油真空泵機組，可實現(xiàn)最短降壓時間
? Adopts high efficient flux collection system to eliminate flux condensation
高效助焊劑回收系統(tǒng)，預(yù)防助焊劑殘留
深圳市史班諾科技有限公司專注為電子制造商提供如下SMT設(shè)備：
INOTIS印刷機、 高迎Koh Young SPI、
奔創(chuàng) PEMTRON AOI、Heller回流焊
等整條SMT生產(chǎn)線設(shè)備，以及零配件、服務(wù)和解決方案。